Intel on Thursday announced that their new massive Hillsboro, Oregon plant, known as D1X will be responsible for the manufacturing of 450 millimeter wafers. Intel had previously announced large investments in a new 22 nanometer manufacturing process.
Intel only says that the plant is “ready” to create the new wafers, however it will continue to manufacturer 300mm wafers for the time being.
Intel only says that they have the necessary abilities to create 450mm wafers when the industry is ready for them and when the new chips can be created they will ultimately increase efficiency and cut costs by allowing more chips to be manufactured at the same time.
We wouldn’t suggest holding your breath for the 450mm chips, one analyst predicts the industry won’t convert to those wafers until at least 2018. [via Engadget ]
